Placa de baza Gigabyte B550M AORUS ELITE, Socket AM4, DDR4, Micro-ATX

Placa de baza Gigabyte AMD B550M AORUS ELITE, 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory 3rd Gen AMD Ryzen™ Processors: Support for DDR4 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules New Generation AMD Ryzen™ with Radeon™ Graphics processors: Support for DDR4 4733(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer „Memory Support List” for more information.) 1 x DVI-D port, supporting a maximum resolution of 1920×1200@60 Hz * The DVI-D port does not support D-Sub connection by adapter. 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz * Support for HDMI 2.1 version, HDCP 2.3, and HDR. 1‎ x PCI Express x16 slot (PCIEX16), integrated in the CPU: 3rd Generation AMD Ryzen™ processors support PCIe 4.0 x16 mode 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors support PCIe 3.0 x16 mode * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot. 1 x PCI Express x16 slot (PCIEX4), integrated in the Chipset: Supporting PCIe 3.0 x4 mode 1 x PCI Express x1 slot (PCIEX1), integrated in the Chipset: Supporting PCIe 3.0 x1 mode 1‎ x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs: 3rd Generation AMD Ryzen™ processors support SATA and PCIe 4.0 x4/x2 SSDs 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs 1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2260/2280 SSDs: Supporting SATA and PCIe 3.0 x2 SSDs 4 x SATA 6Gb/s connectors, integrated in the Chipset: Support for RAID 0, RAID 1, and RAID 10 4 x USB 3.2 Gen 1 ports on the back panel Chipset: 2 x USB 3.2 Gen 1 ports available through the internal USB header 6 x USB 2.0/1.1 ports (4 ports on the back panel, 2 ports available through the internal USB header) 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 2 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 1 x CPU cooler LED strip/RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB 3.2 Gen 1 header 1 x USB 2.0/1.1 header 1 x Trusted Platform Module (TPM) header (2×6 pin, for the GC-TPM2.0_S module only) 1 x serial port header 1 x Clear CMOS jumper 1 x Q-Flash Plus button 1 x PS/2 keyboard/mouse port 1 x DVI-D port 1 x HDMI port 4 x USB 3.2 Gen 1 ports 4 x USB 2.0/1.1 ports 1 x RJ-45 port 3 x audio jacks Micro ATX Form Factor

Pentru a sprijini pe deplin cele mai recente procesoare AMD Ryzen ™ de la cel de-al 3-lea gen, placile de baza B550 sunt echipate cu solutia de putere finala, care este adevarata, digitala si cu mai multe faze. Dupa nenumarate experimente si testari, GIGABYTE prezinta placile de baza B550 imbatabile pentru entuziasti.